Ask the Experts

ASK THE EXPERTS PANEL DISCUSSIONS

Join us for several exciting panels that will be held in the Exhibition Hall of the Devos Place Convention Center during the Symposium Week.  Each panel features speakers who are invited due to their expertise in the panel topic.  The panel topics were selected based on current and emerging technology trends as well as significance to the EMC and SIPI communities.  (Panelists subject to change.)

TUESDAY, AUGUST 1, 2023  •  10:30 AM - 12:00 PM

EMI Issues and Solutions of Modern Power Electronics Systems with Wide Bandgap Semiconductor Devices

Chair: Shuo Wang, University of Florida

Modern power electronics systems employ wide bandgap semiconductor (WBG) devices to achieve high power density and high power efficiency because of their high switching speed. The WBG devices have been widely used in power electronics systems for the electrification of transportation, renewable energy conversion, airspace, consumer electronics, industrial applications, etc. However, WBG devices lead to significant EMI issues compared with conventional Si devices.  A panel consisting of experts from both academies and industry companies will discuss the EMI/EMC issues, solutions, and future trends of WBG-based power electronics systems with the audience. Both panel discussion and Q&A will be conducted at the event.

Planned Panelists Include:

Dehong Liu, Mitsubishi Electric Research Labs
Cong Li, GE Global Research Center
Fang Luo, Stony Brook University

 

TUESDAY, AUGUST 1, 2023  •  1:30 PM - 3:00 PM

EMC Challenges of Automotive Electrification

Chair:  Craig Fanning, Elite Electronic Engineering

Electrified vehicles (EV, HEV and PHEV) have been successfully used on our roadways for over 20 years. Electric vehicles continue to gain market share with some Countries and vehicle OEMs committing to full electrification. Like all electronic products, new electromagnetic compatibility (EMC) challenges are experienced during the design phases as the technology evolves. Electromagnetic noise sources, such as high-power switching operations and high-speed communication bus architectures, can cause issues for both regulatory compliance and self-compatibility. Understanding these potential issues early in the product design cycle can assist OEMs and their suppliers to make EMC-friendly design choices. Proper power electronics design, cable routing, cable shielding, simulation and modeling, and other disciplines all have a part to play in continuing the success in this area. Join experts in this free-form panel discussion to discuss the regulatory environment, associated standards, the main challenges in both design and testing of EVs, and the best strategies for overall EMC success in the EV space.

Planned Panelists Include:

Garth D’Abreu, ETS-Lindgren
Cheyne Scoby, Rivian
Robert Mitchell, TUV
Keith Frazier, Ford
Ron Missier, Ford
Rob Kado, Stellantis

 

WEDNESDAY, AUGUST 2, 2023  •  10:00 AM -11:30 AM

Signal Integrity Challenges of SERDES Interfaces

Chair: James Drewniak, Missouri S&T EMC Laboratory

A Serializer/Deserializer (SerDes) is a pair of functional blocks used in high speed communications that convert data between serial and parallel interfaces in each direction. SerDes provides data transmission over a single lane differential pair in order to minimize the number of I/O pins and interconnects. As data rates continue to increase toward 800G, the signal and power integrity challenges associated with SerDes design at the package and PCB levels increase, including cross-talk, inter-symbol interference (ISI), power-net noise and others. High-speed issues are not specific to SerDes design, and insight into high-speed design in general for SI will be an outcome. A brief summary of SerDes design and challenges will be given and then Q&A with the industry experts that each have many years of experience.

Planned Panelists Include:

John Golding, Siemens
Stephen Scearce, Cisco
Krzysztof Russa, E3 Compliance
Tom Brady, Analog Devices
Hanfeng Wang, Google
Songping Wu, Rivos

 

WEDNESDAY, AUGUST 2, 2023  •  2:00 PM -3:30 PM

Challenges in Medical EMC

Chair: Larry Banasky, Stryker Medical

The safety of patients and caregivers is vitally important when considering the design of medical devices.  Safety considerations, along with the increased use of electronics in environments of use, make medical device EMC a difficult process.  This discussion will focus on the challenges in medical EMC and will include panelists with experience from different facets of the medical device world.

Planned Panelists Include:

Matt Owen, Stryker Instruments
Jeff Silberberg, FDA
David Schaefer, Element Materials Technology

 

THURSDAY, AUGUST 3, 2023  •  10:30 AM -12:00 PM

ML/AI in EMC and SIPI: Opportunities and Road Blocks

Chair: Alistair Duffy, De Montfort University, UK

It seems that everyone is talking about AI these days!  Even within our EMC and signal and power integrity communities, machine learning and artificial intelligence are starting to be used as serious tools to solve challenging problems.  However, the knowledge base within this domain is developing but not yet well established. The EMC Society is keen to change this by building conversations and sharing information.  If you have expertise in ML/AI, have “dabbled” or are simply “AI curious”, please join this panel session where we will address your questions and listen to your experience about where there are immediate opportunities within the EMC and SIPI domain and what are the obstacles that will limit our collective ability to utilize these tools.

Planned Panelists Include:

Richard Gao Xianke, A*STAR Institute of High Performance Computing, Singapore
Lijun Jiang, City University of Hong Kong, Lijun 
Moein Nazari, Cadence, USA
Steve Scearce, USA, Cisco, USA

 

 


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