Please note:
By downloading an eBook, the details of your profile will be shared with the sponsoring company and you may be contacted by them directly.
The material presented in these PDF documents is owned by the sponsoring company and Signal Integrity Journal™. It is presented here to be downloaded by an individual for educational purposes. It may not be downloaded from this site and reposted elsewhere.
SIJ 2024 Issue: The Road from 1 Gbps-NRZ to 224 Gbps-PAM4
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• “Generative AI is in Your Future,” Eric Bogatin, Signal Integrity Journal
• “The Road from 1 Gbps-NRZ to 224 Gbps-PAM4,” Augusto (Gus) Panella, Molex
• “IEEE802.3dj Work on 200 Gbps per Lane and How Different FEC Options Affect SI,” Cathy Ye Liu, Broadcom
• “PCB Laminate Anisotropy: The Impact on Advanced Via Modeling,” Bert Simonovich, Lamsim Enterprises
• “Introducing an Upcoming IEEE Packaging Benchmark,” Istvan Novak and Gustavo Blando, Samtec; Shirin Farrahi, Kristoffer Skytte, and John Phillips, Cadence; Abe Hartman, Oracle; Ethan Koether, Amazon; and Mario Rotigni, STMicroelectronics
• “Assessing the Accuracy of EM Simulation Tools,” Aakriti Srivastava, Micron; Eric Bogatin, Melinda Piket-May, Mohammed Hadi, and Aditya Rao, Univ. of CO
• “Who Put that Inductor in My Capacitor?,” Will McCaffrey, Tyler Huddleston, Benjamin Dannan, and James Kuszewski, Northrop Grumman Mission Systems
• “Worst-Case Bit-Pattern Generator for Eye Diagram Analysis of Non-LTI High-Speed Channels,” Majid Ahadi Dolatsara, Keysight Technologies
• “DesignCon Returns to Celebrate Engineers and Innovation,” Suzanne Deffree, DesignCon
Download Now!
SIJ 2023 Issue, "How Interconnects Work: Characteristic Impedance and Reflections"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• “A National Security Crisis the Industry Can Address,” Eric Bogatin
• “How Interconnects Work: Characteristic Impedance and Reflections,” Yuriy Shlepnev
• “Ultra-Fine Line Differential Pair Design with No Return Plane,” Chaithra Suresh, Eric Bogatin, Melinda Piket-May, Paul Dennig, and Haris Basit
• “Understanding Via Impedance,” Donald Telian
• “The Case for Split Ground Planes,” Eric Bogatin
• “Avoiding GIGO with Field Solvers,” Bert Simonovich
• “Selecting a Backplane: PCB vs Cable Backplane for High-Speed Designs,” Andrew Josephson, Brandon Gore, and Jonathan Sprigler
• “Power Integrity Testing Requirements Introduce Extreme Interconnect Measures,” Steven Sandler
• “DesignCon Returns to January with New Offerings,” Suzanne Deffree
Download Now!
SIJ 2022 Issue, "224 Gbps Link Systems: Modulation vs. Channel vs. FEC"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• "The Reports of Copper’s Death May Be Exaggerated,” Eric Bogatin
• “224 Gbps Link Systems: Modulation vs. Channel vs. FEC,” Mike Li, Hsinho Wu, Masashi Shimanouchi et al
• “High Bandwidth Connectors: Sorting Out What Matters,” Janine Love
• “Measuring High Output Voltage Regulator Noise,” Masashi Nogawa and Steve Sandler
• “Beware of the Skew Budget: How Fiber Weave Effect Can Affect Your High-Speed Design,” Bert Simonovich
• “What to Expect in a Multi-Drop Bus,” Saish Sawant and Tim Wang-Lee
• “Welcome Home: DesignCon Returns to Santa Clara, Calif., in April,” Suzanne Deffree
Download Now!
SIJ 2021 Issue, "Low-Cost and Free Tools Fit For an Engineer's Personal Budget"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• "The Reports of Copper’s Death May Be Exaggerated,” Eric Bogatin
• “224 Gbps Link Systems: Modulation vs. Channel vs. FEC,” Mike Li, Hsinho Wu, Masashi Shimanouchi et al
• “High Bandwidth Connectors: Sorting Out What Matters,” Janine Love
• “Measuring High Output Voltage Regulator Noise,” Masashi Nogawa and Steve Sandler
• “Beware of the Skew Budget: How Fiber Weave Effect Can Affect Your High-Speed Design,” Bert Simonovich
• “What to Expect in a Multi-Drop Bus,” Saish Sawant and Tim Wang-Lee
• “Welcome Home: DesignCon Returns to Santa Clara, Calif., in April,” Suzanne Deffree
SIJ July 2020 Issue, "The Truth About High-Speed Connector Design"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• Eric Bogatin, Technical Editor, Signal Integrity Journal
• Davi Correia, Cadence Design Systems
• Scott McMorrow and Matt Burns, Samtec, Inc.
• Bert Simonovich, Lamsim Enterprises
• Kenneth Wyatt, Wyatt Technical Services LLC
• Cathy Liu, Broadcom
SIJ July 2020 Issue, "The Truth About High-Speed Connector Design"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• Eric Bogatin (Teledyne LeCroy); Larry Smith (Micron); Steve Sandler (Picotest)
• Istvan Novak (Samtec)
• Alex Manukovsky (Intel Corporation); Yuriy Shlepnev (Simberian Inc.)
• Steven Sandler (Picotest)
• Eric Brock and Mike Steinberger (MathWorks)
• Stephen Slater (Keysight Technologies)
• Janine Love (Editor, Signal Integrity Journal)
• Eric Bogatin (Technical Editor, Signal Integrity Journal)
SIJ July 2019 Issue, "Why Are There So Many Standards?"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• Jay Diepenbrock (SIRF Consultants, LLC)
• Sanjeev Gupta (Intel Corp)
• Bill Hargin (Z-zero) & Don DeGroot (CCN)
• Al Horn (Rogers Corp)
• Bert Simonovich (LAMSIM Enterprises Inc.)
• Gary Giust (SiTime)
• Istvan Novak (Samtec)
• Steve Sandler (Picotest)
• Ken Wyatt (Wyatt Technical Services LLC)
SIJ January 2019 Issue, "Power Integrity Challenges"
Download this issue of Signal Integrity Journal featuring articles from industry experts including:
• Eric Bogatin (SIJ Technical Editor)
• Larry Smith (PDNpowerintegrity.com)
• Steve Sandler (Picotest)
• Bert Simonovich (LAMSIM Enterprises Inc.)
• Mike Violette (Washington Laboratories and American Certification Body)
• HeeSoo Lee (Keysight Technologies)
• Nathan Hirsch (Monsoon Solutions Inc.)
• Orlando Bell (GigaTest Labs)
• Marko Marin (Infinera)
• Yuriy Shlepnev (Simberian Inc.)
• Antonio Ciccomancini Scogna (Huawei)
• Davi Correia (Carlisle Interconnect Technologies)
Signal Integrity Journal Publishes First Print Issue
This debut print issue of Signal Integrity Journal™featuring articles from industry experts including:
• Eric Bogatin (SIJ Technical Editor)
• Steve Sandler (Picotest)
• Al Neves (Wild River Technology)
• Bert Simonovich (Lamsim Enterprises)
• Istvan Novak (Oracle)
• John Coonrod (Rogers Corp)